Item Tag: CRC Press

Semiconductor Packaging : Materials Interaction and Reliability, Paperback by…

Semiconductor Packaging : Materials Interaction and Reliability, Paperback by Chen, Andrea; Lo, Randy Hsiao-yu, ISBN 113807540X, ISBN-13 9781138075405, Like New Used, Free shipping in the US This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Expert Systems: Introduction to First and Second Generation and Hybrid Knowledg

Expert Systems: Introduction to First and Second Generation and Hybrid Knowledge Based Systems ISBN : 9780824799274 Title : Expert Systems: Introduction to First and Second Generation and Hybrid Knowledge Based Systems Authors : Nikolopoulos Binding : Hardcover Publisher : CRC Press Publication Date : Jan 10 1997 Condition : Used – Good Ships in a BOX from Central Missouri! May not include working access code. Will not include dust jacket. Has used sticker(s) and some writing or highlighting. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes). Payment We accept PayPal for all eBay orders. Please see payment details below. We will only ship to the address that is entered into PayPal when payment is made! Shipping Multiple shipping options are available for this item. For more detail, please see below, and select the shipping option that is most convenient for you. Returns We have a 30 day return policy. The return must be postmarked within 30 days of the delivery date. Once the item has been returned, we will initiate an item-only refund (shipping costs are non-refundable). We do not provide return labels for general returns.

Surface and Underground Excavations : Methods, Techniques and Equipment, Pape…

Surface and Underground Excavations : Methods, Techniques and Equipment, Paperback by Tatiya, Ratan Raj, ., ISBN 1138496162, ISBN-13 9781138496163, Like New Used, Free shipping in the US This comprehensive text explores the technologies and developments in excavations for any type of surface or underground excavation. Chapters cover various unit operations as well as excavation techniques. Different aspects of design, planning, and analysis as well as the construction of excavations are revised, expanded second edition.